EECS Integrated Circuits Graduate Specialization Spring 2020 Course Preferences Survey

This survey will allow us to estimate the enrollment demand for the courses that are offered for the EECS Integrated Circuits Graduate Specialization program. This is NOT an official course enrollment request. Actual technical course enrollment will occur later through the UC Extension portal.

UC Berkeley EECS in collaboration with UC Berkeley Extension Program is planning to offer graduate-level online courses in IC design, starting in Spring Semester 2020. The depth and breadth of all the courses will be consistent with those offered for UCB’s on-campus graduate students, and all the courses will be taught by UC Berkeley EECS professors. The courses are offered online, with weekly office-hours and hands-on discussions with the faculty and course facilitators. The courses are focused on developing an in-depth and advanced knowledge of the field of Integrated Circuits, including semiconductor devices, analog, digital, mixed-signal and radio-frequency domains.
The courses can be taken as individual courses or in groups toward a certificate of specialization in an area of IC design. The course credits can also be applied toward an MEng degree in the PHYINC concentration, upon admission into the MEng program.

The program offers the following choices:
Individual courses: Registered participants can take any course from the list below and receive individual course completion certificates upon successful course completion.
Specialization groups: Groups of courses can be taken toward earning a Certificate of Specialization in a particular area of IC design. The list below indicates possible groupings:
Semiconductor Devices Specialization (EE W230A, EE W230B, EE247B)
Analog and Mixed-Signal Circuits Specialization (EE W240A, EE W240B, EE W240C)
RF Circuits Specialization (EE W242A, EE W242B)
Digital Design Specialization (EE W241A, EE W241B)

Registration fee: $2,500 per unit.
Typical load for part-time students, one course per semester.
For questions please contact Michael Sun: msun86@eecs.berkeley.edu

Course List and Descriptions:

Base Courses

EE W230A. Integrated-Circuit Devices
Overview of electronic properties of semiconductors. Metal-semiconductor contacts, pn junctions, bipolar transistors, and MOS field-effect transistors. Properties that are significant to device operation for integrated circuits. Silicon device fabrication technology. Units: 4.0
EE W240A. Analog Integrated Circuits
Single and multiple stage transistor amplifiers. Operational amplifiers. Feedback amplifiers, 2-port formulation, source, load, and feedback network loading. Frequency response of cascaded amplifiers, gain-bandwidth exchange, compensation, dominant pole techniques, root locus. Supply and temperature independent biasing and references. Selected applications of analog circuits such as analog-to-digital converters, switched capacitor filters, and comparators. Units: 4.0
EE W241A. Introduction to Digital Integrated Circuits
CMOS devices and deep sub-micron manufacturing technology. CMOS inverters and complex gates. Modeling of interconnect wires. Optimization of designs with respect to a number of metrics: cost, reliability, performance, and power dissipation. Sequential circuits, timing considerations, and clocking approaches. Design of large system blocks, including arithmetic, interconnect, memories, and programmable logic arrays. Introduction to design methodologies, including laboratory experience. Units: 4.0
EE W242A. Integrated Circuits for Communications
Analysis and design of electronic circuits for communication systems, with an emphasis on integrated circuits for wireless communication systems. Analysis of noise and distortion in amplifiers with application to radio receiver design. Power amplifier design with application to wireless radio transmitters. Radio-frequency mixers, oscillators, phase-locked loops, modulators, and demodulators. Units: 4.0

Advanced Courses

EE W230B. Solid State Devices
Physical principles and operational characteristics of semiconductor devices. Emphasis is on MOS field-effect transistors and their behaviors dictated by present and probable future technologies. Metal-oxide-semiconductor systems, short-channel and high field effects, device modeling, and impact on analog, digital circuits. Units: 4.0
EE W240B. Advanced Analog Integrated Circuits
Analysis and optimized design of monolithic operational amplifiers and wide-band amplifiers; methods of achieving wide-band amplification, gain-bandwidth considerations; analysis of noise in integrated circuits and low noise design. Precision passive elements, analog switches, amplifiers and comparators, voltage reference in NMOS and CMOS circuits, Serial, successive-approximation, and parallel analog-to-digital converts. Switched-capacitor and CCD filters. Applications to codecs, modems. Units: 3.0
EE W241B. Advanced Digital Integrated Circuits
Catalog Description: Analysis and design of MOS and bipolar large-scale integrated circuits at the circuit level. Fabrication processes, device characteristics, parasitic effects static and dynamic digital circuits for logic and memory functions. Calculation of speed and power consumption from layout and fabrication parameters. ROM, RAM, EEPROM circuit design. Use of SPICE and other computer aids. Units: 3.0
EE W242B. Advanced Integrated Circuits for Communications
Catalog Description: Analysis, evaluation, and design of present-day integrated circuits for communications application, particularly those for which nonlinear response must be included. MOS, bipolar and BICMOS circuits, audio and video power amplifiers, optimum performance of near-sinusoidal oscillators and frequency-translation circuits. Phase-locked loop ICs, analog multipliers and voltage-controlled oscillators; advanced components for telecommunication circuits. Use of new CAD tools and systems. Units: 3.0
EE W247B. Introduction to MEMS Design
Physics, fabrication and design of micro electromechanical systems (MEMS). Micro and nano-fabrication processes, including silicon surface and bulk micromachining and non-silicon micromachining. Integration strategies and assembly processes. Microsensor and microactuator devices: electrostatic, piezoresistive, piezoelectric, thermal, and magnetic transduction. Electronic position-sensing circuits and electrical and mechanical noise. CAD for MEMS. Design project is required. Units: 4.0
EE W240C. Analysis and Design of VLSI Analog-Digital Interface Integrated Circuits
Architectural and circuit level design and analysis of integrated analog-to-digital and digital-to-analog interfaces in modern CMOS and BiCMOS VLSI technology. Analog-digital converters, digital-analog converters, sample/hold amplifiers, continuous and switched-capacitor filters. Low power mixed signal design techniques. Data communications systems including interface circuitry. CAD tools for analog design for simulation and synthesis. Units: 3.0